Aiscent Technologies, Inc. to unveil new two-sided laser direct imaging system for PCB and High Density Packaging for IC Substrate at IPC/APEX San Diego 2012
Jan 18, 2012
Aiscent Technologies, Inc. will unveil its new ALDI-PB two-sided maskless exposure system for PCB and the ALDI-HDP high density packaging LDI system for IC substrate at the upcoming IPC/APEX Expo in San Diego Feb 28 – March 1.
Aiscent invents the first in the industry two-sided laser direct imaging system which can image both side of the substrate at the same time, this patent pending technology has a pair of dynamic optical engines (or optical engine arrays) aligned vertically to perform direct imaging to the top and bottom side of the substrate simultaneously. This mechanism also eliminates the top and bottom registration issues as the optical engines are pre-aligned.
ALDI-PB is designed for PCB application and is capable of imaging minimum feature sizes of 25um L/S, while the ALDI-HDP is designed for high density packaging for IC substrates and is capable of imaging a minimum feature sizes of 5um L/S. ALDI series maskless exposure systems use a unique imaging procedure to generate a clean high definition image with refined line width and perfect image homogeneity with seamless stitching error. ALDI series laser direct imaging system can provide very high throughput and an improved production yield of high quality products.
Event: IPC/APEX Expo 2012
Venue: San Diego Convention Center, San Diego
Date: Feb 28- March1, 2012
Booth: Number 731
For more information or to schedule a meeting, please contact