Aiscent Technologies, Inc. to unveil latest news of two-sided laser direct imaging system for PCB and High Density Packaging for IC Substrate at CPCA 2012, Shanghai
March 5, 2012
Aiscent Technologies, Inc. will unveil its new ALDI-PB two-sided maskless exposure system for PCB and the ALDI-HDP high density packaging LDI system for IC substrate at the upcoming CPCA Show at Shanghai World Expo Exhibition & Convention Center, March 13 – March 15, 2012.
Please come to visit us, we would like to see you at the show!
Event: CPCA SHOW 2012
Venue: Shanghai World Expo Exhibition & Convention Center, Shanghai
Date: March 13 - March15, 2012
Booth Location: Hall 1, Number L31
For more information or to schedule a meeting, please contact .